New Energy Exploitation and Application

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Transistor Cooling with Nanoparticle Enhanced Phase Change Material

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https://doi.org/10.54963/neea.v3i2.967
Jamalabadi, M. Y. A. (2024). Transistor Cooling with Nanoparticle Enhanced Phase Change Material. New Energy Exploitation and Application, 3(2), 278–292. https://doi.org/10.54963/neea.v3i2.967
Volume 3 Issue 2 (2024)
Copyright (c) 2025 Mohammad Yaghoub Abdollahzadeh Jamalabadi
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In the current paper, the cooling of a bipolar transistor with phase change is investigated. The nanoparticle-enhanced phase change material (NEPCM) can transform from a solid to a liquid by absorbing and releasing energy. The NEPCM is composed of various nanoparticles such as silver, Copper, Aluminum Oxide, Copper (II) oxide, Titanium dioxide, graphene nanoplates, single and multi wall carbon nano tubes (SWCNT- MWCNT) suspended in normal TH29 phase change material. The synthesized NEPCM suspension is used as a passive cooling control system. Heat is uniformly distributed in the sidewall of the heat sink. As sensing and latent heat are absorbed from the transistor walls, the working fluid flows through the storage while because of natural convection inside the storage the Rayleigh–Bénard convection cells created and enhanced the heat transfer management. The volume fraction of added particles, heating power, and strength of streamline affect the controlling parameters of the system such as heat transfer rate, maximum allowable temperature, and thermal performance. The time of process regarding conducted numerical experiments to evaluate the solid-liquid interface through various particles are MWCNT, GNP, SWCNT, Al2O3, TiO2, CuO, Cu, and Ag respectively. Through the various materials, the maximum temperature on the transistor surface is obtained by SWCNT, GNP, MWCNT, Ag, Cu, Al2O3, CuO, and TiO2, respectively. The results presented here and conducting a complete investigation of heat sink storages can be used in transistors or various electronic cooling with the aid of nanofluids.

Keywords:

Transistor; Cooling; Thermal Performance; Nanoparticle; Passive Control

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